| 3DeVOK | MQ Technical Specifications | |
|---|---|---|
| Light Sources | 22 Infrared Laser Lines [Invisible] | Infrared VCSEL Structured Light [Invisible] |
| Class of Lasers | Class Ⅰ (Eye-safe) | |
| Scan Modes | Infrared Laser Lines Supports markerless and invisible-light scanning |
Infrared Linear-array Structured Light (Speckle) Supports markerless scanning, invisible-light scanning, partial fine scanning, and rapid scanning at ultra-long-distance range and ultra-large FoV |
| Accuracy✱ | Up to 0.08 mm | |
| Point Distance | 0.1-5 mm | |
| Alignment Mode | Support hybrid, markers, texture, and geometric features alignment | Support hybrid, texture, and geometric features alignment |
| Ability to Capture Texture | Yes | |
| Scanning Distance | 150-1,000 mm | 150-1,500 mm |
| Field of View | 140 mm × 140 mm – 490 mm × 490 mm | 50 mm × 75 mm – 1,100mm × 1,000mm |
| Scanning Frame | Up to 70 FPS (Marker alignment) | Up to 30 FPS |
| Scanning Speed | Up to 2,450,000 Points/s | Up to 4,500,000 Points/s |
| Output Formats | *.obj, *.stl, *.ply, *.asc, *.mk2, *.txt, *.epj, *.apj, *.spj, *.map, *.sk | |
| The Ability for 3D Printing | Supports .stl, .obj and other formats | |
| Wireless Scanning | Support (with an optional handle) | |
| Working Temperature Range | 0 – 40 ℃ | |
| Working Humidity Range | 10% – 90% RH (Non-condensing) | |
| Interface | USB 3.0 | |
| Scanner Dimensions & Weight | Dimensions: 215 mm × 73 mm × 53 mm; Weight: 550 g | |
| Power Source | DC: 12 V, 5.0 A | |
| Certifications | CE-EMC, FCC, RoHS, IEC 60825, IEC 62471, IEC 60529-IP50, WEEE, KC | |
| Recommended Configurations for PC | OS: Win10/Win11, 64-bit; CPU: i7-13650HX and above; RAM: 32GB and above; Graphic Card: NVIDIA discrete graphics card, NVIDIA RTX3060 and above; Graphics memory: 6GB and above |
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| ✱ The laboratory theoretical accuracy test results are subject to uncertainty errors. | ||